注册 登录  
 加关注
   显示下一条  |  关闭
温馨提示!由于新浪微博认证机制调整,您的新浪微博帐号绑定已过期,请重新绑定!立即重新绑定新浪微博》  |  关闭

Crayon

只想做自己

 
 
 

日志

 
 

Face-to-Face With Packaging  

2012-04-02 00:07:14|  分类: 游戏 |  标签: |举报 |字号 订阅

  下载LOFTER 我的照片书  |

A new semiconductor packaging technology has been developed and is referred to CoC (Chip-on-Chip) packaging or Face-to-Face packaging. This technology utilizes flip-chip technology to form Face-to-Face connections between the memory die and non-memory die. This structure substantially reduces levels of capacitance associated within bond wires and the package lead frame. It also reduces the amount of power required to run circuitry within the memory and non-memory chips. Toshiba has been developing an SCS (Stacked Chip SoC) packaging technology which is similar to CoC packaging technology. Two exemplary chips having this structure are shown in Figure 1.

Face-to-Face With Packaging - Crayon - Crayon
Figure 1
Source: Development of Low Power and High Performance Application Processor (T6G) for Multimedia Mobile Applications, Toshiba Corporation Semiconductor Company Jan. 28, 2011

Global Intellectual Strategies has recently investigated a Sony Multi-chip package Graphic Processor CXD2986A1GG. As shown in Figure 2, this device is a multi-stacked die package having a CoC structure.

Face-to-Face With Packaging - Crayon - Crayon
Figure 2
Source: Global Intellectual Strategies

With reference to Figure 2, die # 2 is a memory die stacked in a Face-to-Face relationship with a non-memory die labeled as die # 1. Further details of the memory die and the non-memory die are shown in Figure 3.


Figure 3
Source: Global Intellectual Strategies

For more information, please contact GIS at www.gistrategies.com

  评论这张
 
阅读(302)| 评论(0)
推荐 转载

历史上的今天

在LOFTER的更多文章

评论

<#--最新日志,群博日志--> <#--推荐日志--> <#--引用记录--> <#--博主推荐--> <#--随机阅读--> <#--首页推荐--> <#--历史上的今天--> <#--被推荐日志--> <#--上一篇,下一篇--> <#-- 热度 --> <#-- 网易新闻广告 --> <#--右边模块结构--> <#--评论模块结构--> <#--引用模块结构--> <#--博主发起的投票-->
 
 
 
 
 
 
 
 
 
 
 
 
 
 

页脚

网易公司版权所有 ©1997-2017